Metaverse
Advanced Optical and Display Substrate Technologies
Creates a Hyper-Realistic
Metaverse
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Camera Module Technology
to Visualize Real Space and Objects
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Camera Module Technology
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3D Sensing Technology
to Deliver Sophisticated Three-dimensional Effect
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3D Sensing Technology
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Ultra-thin Display Substrate Technology
to Realize High-resolution Images
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Ultra-thin Display Substrate Technology
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AR Display Module Technology
to Project Augmented Reality
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AR Display Module Technology
LG Innotek‘s Product Line-up
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Camera Module
ㆍSensing Camera
ㆍImaging Camera
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3D Sensing Module
ㆍToF Module
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Display Solution
ㆍ2 Metal COF
3D Sensing Module
- In-house Optics Design
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- DOE(Diffractive Optical Elements)
- Collimation Lens and Diffuser and IR-Lens for ToF
- Flare &Ghost Simulation
- Manufacturing Process
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- Precise Laser to Optics and Active Alignment
- Laser Compliance Test system for Safety
- Simulation
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- Expertise in VCSEL Control and Simulation
- Compact and High Reliability
- Depth Evaluation System
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- Valuable Core Component Characterization Test
- Near Field/Far Field Safety System
- Precise VCSEL Evaluation
ToF(Time of Flight) module is a state-of-the art product which sense and deliver three-dimensional images in the same depth as human eyes. This product can be applied in XR devices, drones and robotics also.
Key Features
- ㆍPrecise Object Detection through Distance Sensing
- ㆍSmartphone/App On/Off based on 3D Face Recognition
- ㆍFast AF by Calculating the Exact Distance to the Subject
Specification
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- Product
- HQVGA ToF
- 1Mp ToF
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- Sensor
- VGA
- 1Mp
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- Lens
- 80˚, F/1.4
- 136˚(D), 120˚(H), 120˚(V), F/1.2
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- Detection Range
- 0.2~1.5m or 0.5~3m
- 0.1~5m
Camera Module
- Best Modulte Design
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- Advanced R&D for Optimal Performance
- Closed Partnership with Part Makers
- Set Level Verification
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-Standardized Evaluation System for Highly Reliable Products
- In-house Lens Design
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- Capacity to Design Lens Using Various Materials
- Simulation to Minimized Flare and Ghost
- Module Package
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- COB(Chip On Board) Package for Small Form Factor
- For 5G, 4K/8K Video
Sensing camera is applied to IoT, AR/VR devices, etc. to perform user recognition/authentication, gesture recognition, etc
Key Features
- ㆍVGA High Resolution
- ㆍPrecise Recognition of Long Distance
- ㆍNear-wide-angle Recognition based on Various Angles of View
Specification
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- Product
- VGA Sensing Camera
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- Sensor
- VGA(BW), 1/7.5"
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- Lens
- 150˚, F/2.2
Imaging camera is applied to IoT, AR/VR devices to provide various contents such as video call, security, video surveillance, etc.
Key Features
- ㆍTake an Ultra-wide Angle Photo in One Shot
- ㆍWide-angle Camera with Minimal Peripheral Distortion
Specification
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- Product
- 12Mp Imaging Camera
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- Sensor
- 12Mp, 1/2.3"
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- Lens
- 130˚, F/2.4
Display Solution
- Ultra Fine Pitch Patterningt
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- High Quality Ultra Fine Pitch(18um↓)
- Over 4,000 Multi-channel within Limited Space
- Micro Via Hole Technology by Laser Drilling
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- World’s Best Laser Drilling Capacity of Micro Via Hole
- Micro Via Hole(25um ↓) & High Reliability Via Cu Filling
- High Resolution Optical Inspection
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- Automatic Precision Inspection Capacity
for High Reliability and Quality Substrate
- High Flexibility
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- Minimize Display Bezel through High Bending
- Ultra Slim Substrate
2 Metal COF is a key component for displays that transmits electric signals that drive each pixel on the panel. The substrate interconnects a display and a PCB in high-resolution products with design flexibility.
Key Features
- ㆍImplementing Multi Channel through
Fine Pitch Patterning
- ㆍHigh Flexibility and Compact Size via Reducing Assembly Area Size
- ㆍAutomatic Precision Inspection of Micro-circuits
Specification
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- PI Thickness
- 35 ㎛
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- Cu Thickness
- 8㎛
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- Fine Pitch
- 18㎛
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- Line / Space
- 8 / 10㎛
